As electronic products trend toward greater integration and miniaturization, high-precision intelligent dispensing equipment has become a critical component in precision electronic assembly. The positioning accuracy and dispensing precision of this equipment significantly impact the functionality and reliability of precision electronic components and their end products.

From whole-unit assembly of electronic devices to component assembly, device packaging, and chip packaging, operational precision requirements progressively increase, thereby elevating the precision demands on production equipment.

In response, leveraging over a decade of extensive dispensing process experience, Quark Research Institute has independently developed a new generation of high-precision piezoelectric jet dispensing valves—the DOT V20.

The DOT V20 High-Precision Piezoelectric Jet Valve utilizes advanced piezoelectric ceramic actuation technology. It is widely applicable in industries such as high-end displays, mobile phones, cameras, SMT, PCB, medical devices, and wearable technology—any field requiring high precision, high efficiency, and operating within space constraints—delivering high-value precision fluid control solutions to our customers.

01 High Precision & High Speed

• Maximum stable dispensing frequency: 500 Hz

• Maximum instantaneous jetting frequency: 1000 Hz

• Advanced piezoelectric drive mechanism ensures dispensing accuracy of ±1%

• Minimum single-dot dispensing volume: 1 nL, enabling semiconductor-grade precision

02 High Flexibility & High Consistency

• Effectively minimizes defects like splatter and irregularly shaped dots

• Intelligent control system with self-calibration of needle/nozzle alignment

• Maintains highly consistent needle impact force throughout operation

• Advanced, stable piezoelectric drive ensures dot consistency >99%

03 Broad Application Range

• Wide heating range, suitable for ambient temperatures up to 180°C

• Compatible with various media having viscosities from 0 to 200,000 mPa·s

04 Modular Design

• Quick-change design for heating/cooling systems simplifies and speeds up maintenance

• Rich selection of process application kits; wetted-part materials are matched to the specific medium and application

• Various needle configurations and nozzle specifications to suit different media and process requirements, enhancing jetting performance

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Application Scenarios

01 Display Manufacturing

• Adhesives: UV, Tuffy, Silicone, Epoxy, Silver Paste

• Processes: Screen circuit surface protection, conductive bonding, edge sealing, Mini-LED lens encapsulation, bending area protection layer application

02 SMT & PCB

• Adhesives: Underfill, UV, RTV, Red Adhesive, Flux, Solder Paste, Structural Adhesive

• Processes: Component/chip encapsulation, underfilling, IC chip structural bonding, red adhesive dispensing, liquid metal thermal interface material application

03 Wearable Devices

• Adhesives: UV, Epoxy, RTV, Hot Melt, Potting (Silicone)

• Processes: TWS earbud sealing, gap filling, smartwatch bezel sealing, AR glasses sealing & bonding

04 Assembly Dispensing

• Adhesives: Hot Melt, Potting (Silicone)

• Processes: Mobile phone frame sealing, Type-C port waterproofing

05 Module Manufacturing

• Adhesives: Acrylic (UV/Thermal Cure), Underfill, Hot Melt

• Processes: Sidewall underfill, sidewall pin encapsulation, speaker basket dispensing, speaker diaphragm dispensing

06 New Energy

• Adhesives: Silver Paste, Silicone, Conductive Silver Adhesive

• Processes: Solar panel shingling conductive adhesive dotting/line drawing, frame sealing

Applicable Adhesives Guide

01 UV Adhesive
Also known as shadow-curing adhesive, photosensitive adhesive, or UV-curable adhesive. This type of adhesive requires ultraviolet light exposure to cure. It can be used as a bonding agent, as well as a base material for paints, coatings, and inks.

02 Tuffy Adhesive
Tuffy adhesive is a single-component, solvent-based insulating and moisture-proofing product. It exhibits excellent insulation properties across a wide range of temperatures and humidity levels. It offers good adhesion and mechanical properties, providing shock absorption, vibration damping, and a barrier against contaminants.

03 PUR Hot Melt Adhesive
PUR hot melt adhesive products are single-component, moisture-curing reactive polyurethane hot melts. They offer high initial strength, significantly improving customer production efficiency. Excellent self-leveling properties make them suitable for narrow-gap bonding and sealing.

04 Conductive Silver Adhesive
Conductive silver adhesive bonds conductive particles together through the adhesive action of the base resin to form conductive pathways, enabling electrical connection between bonded materials.

05 Red Adhesive
Red adhesive is a polyolefin compound. Unlike solder paste, it cures upon heating, with a solidification temperature of approximately 150°C, transitioning directly from a paste to a solid. It is a common SMT material.

06 Underfill Adhesive
Underfill adhesive is a highly fluid, high-purity epoxy resin material used primarily for capillary underfilling beneath components.

07 Dam Adhesive
A single-component dam silicone sealant. It features excellent adhesion, high strength, and superior aging resistance. It provides moisture, water, ozone, radiation, and weather resistance, and can withstand temperatures up to 260°C. It also offers good electrical properties and chemical stability.

08 Fill Adhesive
Typically a low-stress, low-expansion-coefficient material used to prevent damage to components in the filled area during the curing process.