High-Precision Fluid Control Core Components
Precision Micro-Fluid Control, Pushing the Limits of Processes
Semiconductor
Micron/nanometer-level precision + intelligent closed-loop control, empowering chip miniaturization and yield improvement, meeting the demands of high-integration and low-cost processes.
Wafer Edge Dispensing
Applying thermosetting adhesive to the wafer edge, primarily triggered by high-temperature cross-linking curing, provides ultimate edge protection for wafers in advanced processes.
No scattered dots or overflow;
Supports dispensing in a vacuum environment;
Compatible Medium: Thermosetting adhesive.
Semiconductor Equipment Fixture Surface Coating
A two-component silicone rubber is applied to fixture surfaces (such as wafer carriers, test sockets, probe cards) to create a precision coating that fulfills multiple functions including electrostatic protection, contamination resistance, cushioning against damage, and thermal management.
Coating thickness > 0.1mm;
No scattered dots at vent hole positions;
Uniform overall coating;
Compatible Medium: Two-component silicone rubber.
Application Cases
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