Piezo Jet Valves
High precision, high speed & outstanding stability. Reliable jet dispensing solution for diverse manufacturing processes.
Piezo Jet Valves
High precision, high speed & outstanding stability.
Reliable jet dispensing solution for diverse manufacturing processes.
DOT V20 Jetting Valve-Standard
High Precision, High Efficiency & Superior Stability for Wide Viscosity Range Dispensing
Built for precision microdispensing with ±1% volumetric accuracy. Effectively eliminates dot scattering and air bubbles for reliable dispensing. Suitable for display, 3C, SMT&PCB, PV, semiconductor, medical & aerospace electronics.
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Precise & stable fluid output. Min dot: 200μm, Min line: 250μm
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Works with fluids from 1–200,000 mPa·s
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Max jetting rate: 1,000 shots/sec
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Optimized flow path for consistent dispensing, fewer air bubbles & scattered dots
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Piezo-driven non-contact jetting. Quick parameter switch & software calibration
Compatible Materials：Supports various fluids over a wide viscosity
spectrum, such as: Tuffy glue, conductive silver paste, fluorinated liquid,
SMT red glue, UV adhesive, Underfill, dam & fill, epoxy resin
Applications：Ideal for multiple precision manufacturing scenarios, including:
3C assembly, display modules, camera/sensor modules, FPC reinforcement,
SMT, PCBA underfill, electronic assembly & structural reinforcement
Kit Configuration
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DOT V30 Jetting Valve-Integrated
Quick-disconnect design for easy maintenance; compatible with integrated fluid cartridge heating module.
Ideal for hot melt applications. Adaptable to high-viscosity thermally sensitive materials. Widely deployed in 3C components, power batteries and display module bonding.
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Built-in fluid cartridge heating, max. 180°C
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Quick-release cartridge assembly for easy disassembly & cleaning
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High-precision consistent dispensing. Min. dot: 200μm, Min. line: 250μm
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Optimized flow channel for stable dispensing, consistent bead geometry, reduces air bubbles & stringing
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Non-contact jet dispensing, flexible recipe switching & software calibration
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High-frequency dispensing, max. 1000 shots/sec
Compatible Materials：Suitable for hot melt adhesives and low-viscosity
materials requiring thermal conditioning.
Applications：Precision bonding & filling for 3C parts, electronic components,
photovoltaic cells and power batteries.
Kit Configuration
DOT C30 Piezo Controller with Integrated Temperature Control
Download
→
DOT C28 8-Channel Piezo Controller
Download
→
SCH-101E Single-Channel Heating Controller
Download
→
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DOT V40 Jetting Valve-Fluid mixing
Supports two-component mixing with flexible mixing ratio compatibility.
Engineered for high-precision two-component dispensing. Accommodates various mixing ratios and widely deployed in 3C precision assembly & micro-electronics bonding.
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Designed for two-component AB adhesives, supports multiple ratios (1:10, 1:2, 1:1, etc.)
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Compact structure for convenient part replacement, maintenance and cleaning
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Precise consistent dispensing. Min. dot: 200 μm, Min. line: 250 μm
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Optimized flow channel enables stable dispensing with consistent deposits, reduces stringing & cut-off defects
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Non-contact jet dispensing, flexible recipe switching and software calibration
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High-frequency operation, max. 1000 shots/sec
Compatible Materials：Various AB adhesives, two-component structural
adhesives and epoxy resins.
Applications：Bonding for 3C assembly, display modules, speaker modules,
camera modules, aerospace precision electronics and FPC reinforcement, and
other two-component dispensing scenarios.
Kit Configuration
DOT C30 Piezo Controller with Integrated Temperature Control
Download
→
DOT C28 8-Channel Piezo Controller
Download
→
SCH-101E Single-Channel Heating Controller
Download
→
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DOT V60 Jetting Valve-Solder
Designed for micro solder paste jetting, delivering stable performance with low clogging risk.
Optimized for precision solder paste jetting. Enables non-contact, micron-level dispensing for low-viscosity solder paste, widely used in SMT and PCB dispensing applications.
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Optimized for precision solder paste jetting, stable long-run production with minimal clogging
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High-consistency dispensing. Min. dot: 200 μm, Min. line: 250 μm (Type 6)
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Tuned flow channel ensures consistent deposits and reduces scattered dots
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Non-contact jet dispensing, flexible recipe switching & software calibration
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High-frequency operation, max. 1000 shots/sec
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Compact structure for easy replacement, maintenance and cleaning
Compatible Materials：6 & #7 solder paste
Applications：Precision solder paste dispensing for SMT assembly, PCBA,
display module rework, photovoltaic modules and other micro-coating processes.
Kit Configuration
DOT C30 Piezo Controller with Integrated Temperature Control
Download
→
DOT C28 8-Channel Piezo Controller
Download
→
SCH-101E Single-Channel Heating Controller
Download
→
Related Products
Process Applications
QUARK Piezo Jet Valves have been widely adopted in a diverse range of advanced
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UV Glue
Bubble-free, no scattered dots
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Conductive Silver Adhesive
Minimum dot diameter 1mm, CPK > 1.67, thickness < 0.15mm
锡膏
Solder Paste
Minimum line width 0.25mm
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Thermosetting Adhesive
Continuous dispensing with uniform consistency and no stringing
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Underfill Adhesive
No component contamination or scattered dots
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Silicone
Stable and uniform beads without bubbles
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Blue Tuffy Adhesive
Adhesive thickness 0.44mm
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Red Adhesive
Dot diameter CPK > 1.33
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AB Adhesive
Supports different mixing ratios, long-term dispensing without clogging or abnormalities
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