High-Precision Fluid Control Core Components

Precision Micro-Fluid Control, Pushing the Limits of Processes

  • Micro/Nano-Level Fluid Control

    Specializing in precision micro-fluid control, leveraging two core product series—nanoliter-scale piezoelectric valves and picoliter-scale EHD electrohydrodynamic systems—to meet high-precision process requirements.

  • Enhanced Defect Suppression

    Optimized structural design ensures uniform and stable dispensing over extended periods, free from defects such as scattered dots, bubbles, or broken adhesive lines.

  • Full Compatibility with Fluid Media

    Flexibly adapts to various jetting materials, suitable for a wide range of fluid control scenarios with viscosities from 0 to 200,000 mPa·s.

  • Micro/Nano-Level Fluid Control

    Specializing in precision micro-fluid control, leveraging two core product series—nanoliter-scale piezoelectric valves and picoliter-scale EHD electrohydrodynamic systems—to meet high-precision process requirements.

  • Enhanced Defect Suppression

    Optimized structural design ensures uniform and stable dispensing over extended periods, free from defects such as scattered dots, bubbles, or broken adhesive lines.

  • Full Compatibility with Fluid Media

    Flexibly adapts to various jetting materials, suitable for a wide range of fluid control scenarios with viscosities from 0 to 200,000 mPa·s.

Piezoelectric Jet Valve Product Line

Precision fluid control technology enabling non-contact, high-speed, and high-accuracy dispensing at micro- and nano-liter droplet scales.

  • Minimum dispensing volume: 1nL

  • Minimum dot diameter: <0.2mm

  • Minimum line width: 0.25mm

  • Fluid control accuracy: ±1%

  • Maximum jetting frequency: 1000HZ

  • Supports variable-frequency adjustment

EHD (Electrohydrodynamic) Product Line

Innovative EHD technology for precise manipulation of complex fluids and high-viscosity media, achieving fine deposition at micro-/nano-scales.

  • Core components: Electronic control module and nozzle

  • Error compensation: Electric field correction + electrode control

  • Monitoring and compensation: Real-time monitoring system + dynamic parameter optimization

  • Accuracy down to femto-liter (fL) level

  • Modes: Dot jetting, direct writing, atomization

Piezoelectric Valve
Controller
Parts & Accessories
  • DOT V20 Universal Piezoelectric Valve

    High precision, high efficiency, high stability, compatible with a wide viscosity range

  • DOT V30 Integrated Cartridge Quick‑Release Valve

    Quick‑release design for easy maintenance, flexibly integrates with cartridge heating module

  • DOT V40 Two‑Component Piezoelectric Valve

    Supports two‑component adhesive mixing, compatible with different mixing ratios

  • DOT V60 Solder Paste Piezoelectric Valve

    Designed specifically for precision solder paste jetting applications, ensures consistent performance and resists clogging

  • DOT C28 8‑Channel Piezoelectric Controller

    A single device can control up to eight valves simultaneously, meeting the demands of large‑scale, high‑efficiency precise fluid control.

  • DOT C30 Piezoelectric Controller with Integrated Temperature Control

    Features integrated cartridge temperature control to suit application scenarios involving temperature‑sensitive media.

  • SCH‑101D Heating Controller

    Lightweight design for agile installation, supports dual‑heating applications for both glue barrel and nozzle.

  • Glue Supply Heating Module

    High precision, high efficiency, high stability, compatible with a wide viscosity range

  • Cartridge Heating Module

    Quick‑release design for easy maintenance, flexibly integrates with cartridge heating modules

  • Glue Barrel Heating Module

    Supports two‑component adhesive mixing, compatible with different mixing ratios

Process Applications

QUARK precision dispensing systems have been widely adopted in a diverse range of advanced manufacturing processes

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UV Glue

Bubble-free, no scattered dots

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Conductive Silver Adhesive

Minimum dot diameter 1mm, CPK > 1.67, thickness < 0.15mm

锡膏
Solder Paste

Minimum line width 0.25mm

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Thermosetting Adhesive

Continuous dispensing with uniform consistency and no stringing

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Underfill Adhesive

No component contamination or scattered dots

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Silicone

Stable and uniform beads without bubbles

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Blue Tuffy Adhesive

Adhesive thickness 0.44mm

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Red Adhesive

Dot diameter CPK > 1.33

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AB Adhesive

Supports different mixing ratios, long-term dispensing without clogging or abnormalities