According to IRENA's 2023 report, the levelized cost of electricity (LCOE) for solar PV fell by 87% between 2010 and 2023. Against the backdrop of the global energy transition, the photovoltaic industry continues to pursue cost reduction and efficiency improvement as its core objective.

Consequently, technological innovations such as wafer thinning, tiling ribbon cell structures, new material applications, and bifacial modules are emerging continuously. These changes also impose higher requirements on the precision and reliability of the encapsulation process.

As an expert in micro-fluidic control, Quark Research Institute delves deeply into PV industry application scenarios, relying on numerous "micro-processes" to drive significant changes for cost reduction and efficiency improvement in the photovoltaic sector.

Technological Innovations Impose Higher Demands on Encapsulation Processes

Improving light-energy conversion efficiency and reducing manufacturing costs have always been key drivers for enhancing the competitiveness of PV module manufacturers. More extreme cost compression and structural design demand higher standards for encapsulation processes.

l Process and Structural Changes
Taking the significant structural change to tiling ribbon technology as an example, after the structural modification, module power increases while silver consumption decreases substantially.

Data from leading industry players shows that applying tiling ribbon technology can currently reduce silver paste consumption by 75%. In the future, it may even eliminate silver usage entirely. For heterojunction (HJT) and back-contact (BC) cells, where silver paste costs are higher, the cost-reduction effect is even more pronounced.

*via CPIA "PV Industry Development Roadmap (2024-2025)"*

However, more complex structures demand stronger weatherability from bonding materials. Compared to conventional methods of directly printing materials onto cells, the fixation precision and reliability of busbars/wires present a new challenge.

l Thinning and Lightweighting Trends
According to CPIA's "China PV Industry Development Roadmap": currently, PV module silicon wafer thickness has decreased from 180μm (2016) to 130μm (2023), and PV glass has thinned from 4.0mm to 2.0mm.

*via CPIA "PV Industry Development Roadmap (2024-2025)"*

The thinning trend effectively reduces silicon consumption and wafer costs. While slicing technology can currently meet thinning needs, wafer thickness must also satisfy the requirements of downstream cell and module manufacturing.

Reduced material mechanical strength necessitates higher-precision bonding and protection processes to prevent micro-cracks and breakage.

The technology transformations in the PV industry, aimed at cost reduction and efficiency improvement, require support from more stringent process capabilities to achieve large-scale implementation and promotion.

Quark's Micro-Processes Facilitate Technological Implementation

Relying on high-precision fluid control technology, Quark Research Institute focuses on key steps in PV module encapsulation, such as pre-soldering flux application and structural protection/fixation. We support the large-scale implementation of new technologies through micro-fluidics processes, helping PV module manufacturers achieve further cost reduction and efficiency gains.

l More Precise Fluid Control Capability and Reliability
Addressing the technical trends of wafer thinning and finer gridlines, Quark's piezoelectric valves meet various stringent process requirements through micro-fluidic control.

· PV Module Protection and Fixation: Quark's piezoelectric valves, with their ability to achieve thinner adhesive layers and more precise, uniform adhesive lines, are widely used in PV module protection and fixation.

• Compatible Medium: UV Adhesive

• Adhesive Thickness: 0.1-0.4 mm

• Adhesive Width: 0.25-2.0 mm

• Adhesive Width Variation <30μm, CPK>1.67

• No bubbles, no splatter

Furthermore, to meet the demands of large-scale production scenarios, Quark supports a single controller driving eight valve bodies, with coating speeds up to 200-300mm/s, ensuring stable dispensing performance alongside higher efficiency.

l Broader Media Compatibility and Complex Scenario Adaptability
Quark's piezoelectric valves offer full-range media compatibility, meeting new process requirements or customized needs arising from various technical scenarios.

· Pre-Soldering Flux: Quark's piezoelectric valves can adapt to different fluxes, such as rosin-based liquid flux. Through precise control, they enable pre-treatment of busbars or seed layers, ensuring stable and reliable soldering.

• Compatible Medium: Rosin-based Liquid Flux

• Adhesive Thickness <0.05mm

• Minimum Adhesive Width: 0.25mm

• Adhesive Width Variation <30μm, CPK>1.67

• No clogging, breakage, or deposition during prolonged operation

Additionally, Quark's piezoelectric valves, leveraging precise fluid control, are extensively applied in different stages such as conductive repair and structural bonding of PV modules. This enhances manufacturing yield and efficiency while ensuring quality reliability under extreme cost-reduction conditions.

When new technologies approach material and cost limits, manufacturing precision and reliability become the critical threshold for their implementation.

On the "main course" of cost reduction and efficiency improvement in the PV industry, Quark Research Institute will continue to rely on extensive scenario applications and process experience to provide support for the industry's leap forward.

With micro-precision power, ensuring every inch of technological breakthrough safely reaches its destination.