Consumer Electronics

High-precision, intelligent dispensing meets the demands for refinement and integration in 3C manufacturing, achieving improved quality, cost reduction, and efficiency gains.

Hot Melt Adhesive for Mobile Phone Mid‑Frames, Watch Bezels, Earphones, AR Glasses, etc.

During the assembly of mobile phone mid‑frames, watch bezels, earphones, and AR glasses, hot melt adhesive is dispensed to seal and bond the structures, providing internal waterproofing, dust resistance, and moisture protection.

Coating Diameter: < 0.3mm

Adhesive Line Requirements: No breaks, no bubbles

Glue Width Range: < 30μm, CPK > 1.67

Compatible Medium: Hot melt adhesive

Camera Module

In devices such as smartphones, the camera module—which contains precision optical components like lenses, image sensors, and brackets—is assembled and fixed onto the device frame. Dispensing processes are often used to provide structural bonding strength, ensure stable module positioning, and deliver dust, moisture, and shock protection for sensitive optical elements.

VCM motor lens barrel bracket magnet sheet reinforcement: dispensing height < 2mm, free from scattered dots and bubbles.

VCM motor FPC coil solder joints and coil center reinforcement: no missingdispensing, adhesive coverage > 80% of pad area.

VCM motor base corner reinforcement and IC slot filling: complete encapsulation of solder joints, no voids, pits, protrusions, or overflow.

Camera module gap filling and FPC bend reinforcement: adhesive surface on joint feet is smooth, free from voids or small holes; no adhesive overflow at joint positions.

Compatible media: UV adhesive, underfill adhesive, epoxy adhesive.

Side SW Module

Primarily used for physical button switch modules on the side of devices, securely bonded and sealed into the side‑frame openings to provide structural support and prevent moisture and dust from entering the device through button gaps.

Coating diameter < 0.3mm

No bubbles or only minimal bubbles

Glue width range < 30μm, CPK > 1.67

Compatible media: acrylic adhesive (UV + thermosetting), Underfill adhesive

Speaker Module

The sound‑producing unit (speaker or receiver) is assembled into the reserved acoustic cavity or opening in the device housing to form an essential seal. This prevents water and dust from entering and damaging internal components while maintaining the integrity of the acoustic structure for optimal sound performance.

Coating diameter: 1.0mm–1.2mm

Compatible medium: hot melt adhesive

Coating thickness: 0.2mm–0.5mm

Type‑C Waterproofing

Mainly applied for sealing around USB Type‑C charging/data ports, creating a waterproof and dustproof barrier between the port and the device housing. This prevents liquids (e.g., sweat, rain) and dust from entering the device through the port gap, which is especially critical for frequently plugged/unplugged interfaces.

No bubbles in dispensing

Compatible medium: potting adhesive (silicone)

Complete adhesive filling, no overflow

Camera Module

In devices such as smartphones, the camera module—which contains precision optical components like lenses, image sensors, and brackets—is assembled and fixed onto the device frame. Dispensing processes are often used to provide structural bonding strength, ensure stable module positioning, and deliver dust, moisture, and shock protection for sensitive optical elements.

VCM motor lens barrel bracket magnet sheet reinforcement: dispensing height < 2mm, free from scattered dots and bubbles.

VCM motor FPC coil solder joints and coil center reinforcement: no missing dispensing, adhesive coverage > 80% of pad area.

VCM motor base corner reinforcement and IC slot filling: complete encapsulation of solder joints, no voids, pits, protrusions, or overflow.

Camera module gap filling and FPC bend reinforcement: adhesive surface on joint feet is smooth, free from voids or small holes; no adhesive overflow at joint positions.

Compatible media: UV adhesive, underfill adhesive, epoxy adhesive.

Side SW Module

Primarily used for physical button switch modules on the side of devices, securely bonded and sealed into the side‑frame openings to provide structural support and prevent moisture and dust from entering the device through button gaps.

Coating diameter < 0.3mm

No bubbles or only minimal bubbles

Glue width range < 30μm, CPK > 1.67

Compatible media: acrylic adhesive (UV + thermosetting), Underfill adhesive

Speaker Module

The sound‑producing unit (speaker or receiver) is assembled into the reserved acoustic cavity or opening in the device housing to form an essential seal. This prevents water and dust from entering and damaging internal components while maintaining the integrity of the acoustic structure for optimal sound performance.

Coating diameter: 1.0mm–1.2mm

Compatible medium: hot melt adhesive

Coating thickness: 0.2mm–0.5mm

Type‑C Waterproofing

Mainly applied for sealing around USB Type‑C charging/data ports, creating a waterproof and dustproof barrier between the port and the device housing. This prevents liquids (e.g., sweat, rain) and dust from entering the device through the port gap, which is especially critical for frequently plugged/unplugged interfaces.

No bubbles in dispensing

Compatible medium: potting adhesive (silicone)

Complete adhesive filling, no overflow

Ink Spraying

Ink spraying primarily serves for PCB electrical insulation, with applications including but not limited to marking patterns on metal or plastic components, brand logo filling, etc.

Glue width range < 30μm, CPK > 1.67

Compatible Medium: Ink

The ink coverage is uniform, free from scattered dots and overflow.

Ink Spraying

Ink spraying primarily serves for PCB electrical insulation, with applications including but not limited to marking patterns on metal or plastic components, brand logo filling, etc.

Glue width range < 30μm, CPK > 1.67

Compatible Medium: Ink

The ink coverage is uniform, free from scattered dots and overflow.

Fluorinated Liquid Coating

A fluorinated liquid is applied to the surface of IR chips to prevent contaminants from adhering during the manufacturing process. The liquid is subsequently cleaned off in later process steps using dedicated cleaning equipment.

No adhesive overflow outside the dispensing area

No scattered dots or bubbles

Fluorinated liquid coverage on the IR chip > 90%

Compatible Medium: Fluorinated liquid

Application Cases

Metal Component Marking Protection

Mobile Phone Mid‑Frame Dispensing