SMT&PCB

High precision, high efficiency, stability, and reliability. Aligns with the industry trends of high integration, miniaturization, and high reliability, facilitating industrial upgrading.

Component Encapsulation

A protective adhesive is applied to the surface of electronic components to provide shielding, dust resistance, moisture protection, and other protective functions.

Coating diameter < 0.3mm

No bubbles or only minimal bubbles

Glue width range < 30μm, CPK > 1.67

Compatible medium: Acrylic adhesive (UV + thermosetting)

Chip Underfilling

By forming a consistent and defect‑free underfill layer, it effectively mitigates stress caused by the coefficient of thermal expansion mismatch between the silicon chip and the substrate, as well as external mechanical shock.

No bubbles or only minimal bubbles

Compatible medium: Underfill adhesive

Minimizes scattered dot rate to the greatest extent

IC Chip Bonding

The structural fixation of IC chip bonding is a core process in electronics manufacturing. Its role extends beyond simple physical adhesion, directly impacting device reliability, thermal performance, and electrical connection integrity.

Coating diameter: 0.3mm

Optimized configuration and parameters to suppress bubbles, achieving bubble‑free or near bubble‑free results

Glue width range < 30μm, CPK > 1.67

Compatible medium: Structural adhesive

Chip Underfilling

By forming a consistent and defect‑free underfill layer, it effectively mitigates stress caused by the coefficient of thermal expansion mismatch between the silicon chip and the substrate, as well as external mechanical shock.

No bubbles or only minimal bubbles

Compatible medium: Underfill adhesive

Minimizes scattered dot rate to the greatest extent

IC Chip Bonding

The structural fixation of IC chip bonding is a core process in electronics manufacturing. Its role extends beyond simple physical adhesion, directly impacting device reliability, thermal performance, and electrical connection integrity.

Coating diameter: 0.3mm

Optimized configuration and parameters to suppress bubbles, achieving bubble‑free or near bubble‑free results

Glue width range < 30μm, CPK > 1.67

Compatible medium: Structural adhesive

Red Adhesive

Primarily used for temporarily securing components before wave soldering. On one hand, it ensures that the components withstand the impact of molten solder during wave soldering, preventing them from being washed away. On the other hand, it balances the tension at both ends of the components, avoiding single‑end lifting of small‑size parts when the solder melts.

No bubbles or only minimal bubbles

Compatible medium: Red adhesive

Minimizes scattered dot rate to the greatest extent

Liquid Metal

As high‑end consumer electronic devices operate at increasing power levels, their thermal effects become more severe. Liquid metal (with thermal conductivity up to 73 W/m·K) largely addresses heat dissipation issues due to its exceptional cooling performance.

Adhesive weight range deviation < ±5%

Adhesive line free from waves or breaks

CPK＞1.67

Compatible Medium: Liquid Metal

Application Cases